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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2020CZER150M51
- Part Number IHLP2020CZER150M51
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2020CZER150M51 Details
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Manufacturer Part Number:
IHLP2020CZER150M51
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.3
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Case/Size Code:
2020
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Construction:
Rectangular
IHLP2020CZER150M51 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP2020CZER150M51 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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While IHLP2020CZER150M51 has a rated operating temperature range of -40°C to +125°C, it's not recommended for high-temperature applications above 105°C due to potential degradation of the magnetic properties and increased core losses.
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To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the thermal stress on the component, and avoid applying excessive force or pressure.
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Yes, IHLP2020CZER150M51 is compatible with lead-free soldering processes, such as SAC305 (Sn-Ag-Cu) or other lead-free solder alloys. However, the soldering profile may need to be adjusted to ensure proper wetting and solder joint reliability.
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The ESR of IHLP2020CZER150M51 is not explicitly stated in the datasheet, but it can be estimated to be around 10-20 mΩ at 100 kHz, based on the component's inductance and DC resistance values.
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IHLP2020CZER150M51 Overview
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