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IHLP2020CZERR10M01 - Vishay

Description: Vishay IHLP2020CZ-01 Series Shielded Wire-wound SMD Inductor 0.1 μH ±20% 27A Idc

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IHLP2020CZERR10M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 2020 (5252 metric)-1
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IHLP2020CZERR10M01 - Vishay  - 3D model - Inductors Precision Moulded - 2020 (5252 metric)-1
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IHLP2020CZERR10M01 Details

  • Manufacturer Part Number:

    IHLP2020CZERR10M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

IHLP2020CZERR10M01 Frequently Asked Questions (FAQs)

  • The recommended PCB land pattern for the IHLP2020CZERR10M01 can be found in the Vishay Intertechnologies' application note AN2002, which provides guidelines for PCB layout and land pattern design for IHLP inductors.
  • The IHLP2020CZERR10M01 has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to consider thermal management during PCB design, such as providing adequate spacing between components, using thermal vias, and selecting a suitable PCB material with high thermal conductivity.
  • The self-resonant frequency of the IHLP2020CZERR10M01 is not explicitly stated in the datasheet. However, it can be estimated using the inductor's inductance value and the parasitic capacitance. A rough estimate can be made using the formula: SRF ≈ 1 / (2 * π * sqrt(L * C)), where L is the inductance and C is the parasitic capacitance.
  • The IHLP2020CZERR10M01 is a surface-mount inductor, and its mechanical robustness is suitable for most applications. However, it's essential to consider the vibration and shock requirements of your specific application. Vishay Intertechnologies recommends following the guidelines in their application note AN2013 for designing and testing inductors in high-vibration environments.
  • To ensure the IHLP2020CZERR10M01 meets your application's EMI requirements, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components as needed. Additionally, consider using a ferrite bead or common-mode choke in conjunction with the IHLP2020CZERR10M01 to reduce EMI emissions.

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IHLP2020CZERR10M01 Overview

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