IHLP2525BDER1R5M01 footprint, schematic symbol and 3D model by Vishay

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IHLP2525BDER1R5M01 Details

The recommended PCB footprint for the IHLP2525BDER1R5M01 is a rectangular pad with a length of 2.5 mm, a width of 2.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
The IHLP2525BDER1R5M01 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be mounted on a PCB with a thermal via or a thermal pad to dissipate heat. Additionally, the surrounding components should be chosen to minimize thermal interference.
The recommended soldering process for the IHLP2525BDER1R5M01 is a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
To ensure magnetic shielding, the IHLP2525BDER1R5M01 should be mounted on a PCB with a solid copper ground plane underneath the inductor. Additionally, the inductor should be placed at least 1 mm away from other components to minimize magnetic interference.
The IHLP2525BDER1R5M01 has a moisture sensitivity level (MSL) of 3, which means it can withstand a maximum of 168 hours of exposure to 30°C and 60% relative humidity before soldering.

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Image	Part Number	Model
	IHLP2525BDER1R5MA1 Vishay Intertechnologies General Purpose Inductor, 1.5uH, 20%, 1 Element, Composite-Core, SMD, 2525
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