The recommended PCB footprint for IHLP2525CZER1R0M06 is a rectangular pad with dimensions of 2.5 mm x 2.5 mm, with a 0.5 mm x 0.5 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) thermal pad.
To ensure proper thermal management, it is recommended to provide a thermal path from the inductor to a heat sink or a large copper area on the PCB. The thermal pad of the inductor should be connected to the thermal path using a thermal interface material (TIM) such as thermal tape or thermal grease.
The maximum operating temperature range for IHLP2525CZER1R0M06 is -40°C to +125°C. However, the inductor's performance may degrade at higher temperatures, and the maximum current rating may need to be derated accordingly.
Yes, IHLP2525CZER1R0M06 is designed for high-frequency switching applications up to 1 MHz. However, the inductor's performance may vary depending on the specific application and operating conditions. It is recommended to consult the datasheet and application notes for more information.
To select the correct inductor value, you need to consider the specific requirements of your application, including the operating frequency, current rating, and inductance value. You can use online tools and calculators or consult with an applications engineer to determine the optimal inductor value for your design.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IHLP2525CZER1R0M06 Overview
Use the download button to access the IHLP2525CZER1R0M06 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IHLP2,
or try a keyword search, such as Fixed Inductors
