Description:Shielded construction
• Frequency range below 1.0 MHz
• Lowest DCR/μH, in this package size
• Powdered iron composition provides soft
saturation
• Handles high transient current spikes without
saturation
• Saturation and inductance extremely stable over
temperature
• Ultra low buzz noise, due to composite construction
• IHLP design; PATENT(S): www.vishay.com/patents
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
The recommended PCB footprint for the IHLP2525EZER1R0M01 is a rectangular pad with a length of 2.5 mm, a width of 2.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
The IHLP2525EZER1R0M01 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be kept away from heat sources, and the PCB should be designed to dissipate heat efficiently. A thermal via or thermal pad can be used to improve heat dissipation.
The self-resonant frequency of the IHLP2525EZER1R0M01 is not explicitly stated in the datasheet. However, it can be estimated using the inductor's inductance and capacitance values. Typically, the self-resonant frequency of an inductor is in the range of tens to hundreds of MHz.
Yes, the IHLP2525EZER1R0M01 is suitable for high-frequency applications up to several hundred kHz. However, the inductor's performance may degrade at very high frequencies due to skin effect and proximity effect. It's essential to evaluate the inductor's performance in the specific application and consider the effects of frequency on the inductor's behavior.
To ensure proper soldering, the IHLP2525EZER1R0M01 should be placed on a PCB with a solder mask defined (SMD) pad. The inductor should be aligned with the pad, and a soldering iron with a temperature of 250°C to 270°C should be used. The soldering process should be done in a well-ventilated area, and the inductor should be handled by the edges to prevent damage.
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IHLP2525EZER1R0M01 Overview
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