The recommended land pattern for IHLP3232DZER1R0MA1 is a rectangular pad with a size of 3.3 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad and a solder mask opening of 2.5 mm x 1.5 mm.
To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB under the inductor, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Additionally, ensure good airflow around the inductor and avoid blocking the airflow with nearby components.
The maximum operating temperature range for IHLP3232DZER1R0MA1 is -40°C to +125°C, with a derating of inductance and saturation current above 80°C.
To select the correct inductor value, consider the operating frequency, current requirements, and voltage ripple of your application. Use the inductor's impedance vs. frequency curve and the saturation current rating to ensure the inductor can handle the expected current and voltage stress.
Yes, IHLP3232DZER1R0MA1 is compatible with lead-free soldering and is RoHS compliant.
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IHLP3232DZER1R0MA1 Overview
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