The recommended PCB footprint for IHLP4040DZET330M11 is a rectangular pad with dimensions of 4.5 mm x 4.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should be solder-mask defined with a non-solder-mask-defined (NSMD) pad.
To ensure proper thermal management, it is recommended to provide a thermal path from the inductor to a heat sink or a large copper area on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. The PCB should be designed to minimize thermal resistance and ensure good airflow around the inductor.
The maximum operating temperature range for IHLP4040DZET330M11 is -40°C to +125°C. However, the inductor's performance may degrade at higher temperatures, and the core may saturate above 100°C. It is recommended to derate the inductor's current rating at higher temperatures.
To select the correct inductor, consider the following factors: inductance value, current rating, DC resistance, and operating frequency. The IHLP4040DZET330M11 is suitable for high-frequency applications up to 1 MHz, with a high current rating of 33 A and a low DC resistance of 1.1 mΩ. Ensure that the inductor meets the specific requirements of your application.
The equivalent series resistance (ESR) of IHLP4040DZET330M11 is not explicitly stated in the datasheet. However, the ESR can be estimated from the inductor's DC resistance and the operating frequency. For IHLP4040DZET330M11, the ESR is approximately 1.1 mΩ at 100 kHz.
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IHLP4040DZET330M11 Overview
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