The recommended PCB footprint for the IHLP5050EZER1R5M01 is a rectangular pad with a length of 5.5 mm, a width of 5.0 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape with a diameter of 1.5 mm for the pin.
The IHLP5050EZER1R5M01 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be mounted on a PCB with a thermal via or a thermal pad to dissipate heat. The surrounding components should also be chosen to minimize thermal interference.
The recommended soldering process for the IHLP5050EZER1R5M01 is a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
To ensure magnetic shielding, the IHLP5050EZER1R5M01 should be mounted on a PCB with a solid copper ground plane underneath the inductor. The PCB should also have a minimum of 1 oz copper thickness to minimize eddy current losses.
The IHLP5050EZER1R5M01 has a moisture sensitivity level (MSL) of 3, which means it can withstand a maximum of 168 hours of exposure to 30°C and 60% relative humidity before soldering.
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IHLP5050EZER1R5M01 Overview
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