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IHLP5050EZER5R6M01 - Vishay

Description: Vishay IHLP-5050EZ-01 Series Type 5050 Shielded Wire-wound SMD Inductor 5.6 µH ±20% Wire-Wound 22A Idc

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IHLP5050EZER5R6M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IHLP5050EZER3R3M001--
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IHLP5050EZER5R6M01 - Vishay  - 3D model - Inductors Precision Moulded - IHLP5050EZER3R3M001--
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IHLP5050EZER5R6M01 Details

  • Manufacturer Part Number:

    IHLP5050EZER5R6M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    5251

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0165 Ω

  • Inductance-Nom (L):

    5.6 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5 mm

  • Package Length:

    13.2 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    11.5 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050EZER5R6M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP5050EZER5R6M01 is a rectangular pad with a length of 5.5 mm, a width of 5.0 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
  • To handle the high self-resonant frequency of the IHLP5050EZER5R6M01, ensure that your PCB layout and component selection minimize parasitic inductance and capacitance. Use a low-ESR capacitor in parallel with the inductor to dampen resonant peaks, and consider adding a series resistor to reduce Q-factor.
  • The IHLP5050EZER5R6M01 is rated for operation up to 125°C. However, its inductance and resistance may vary with temperature. Ensure that your design takes into account the inductor's temperature coefficient and derating factors to ensure reliable operation.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes thermal stress, and avoid applying excessive force or vibration during the soldering process.
  • Store the IHLP5050EZER5R6M01 in its original packaging or a similar ESD-protective package. Handle the components by the body, avoiding touching the leads or electrical contacts. Use an anti-static wrist strap or mat when handling the components to prevent ESD damage.

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IHLP5050EZER5R6M01 Overview

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