The recommended land pattern for the IHLP5050FDER1R2M01 is a rectangular pad with a size of 5.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP5050FDER1R2M01 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a thermal interface material (TIM) to improve heat transfer between the inductor and the PCB.
The SRF of the IHLP5050FDER1R2M01 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. A rough estimate can be made using the formula: SRF ≈ 1 / (2 * π * sqrt(L * C)), where L is the inductance and C is the capacitance.
The IHLP5050FDER1R2M01 is designed for high-frequency applications, but its performance may degrade above 100 MHz. Be sure to evaluate the inductor's impedance and loss characteristics at the specific frequency of interest.
Follow the recommended soldering profile for the IHLP5050FDER1R2M01, which includes a peak temperature of 260°C and a soldering time of 3-5 seconds. Ensure the PCB is clean and free of oxidation, and use a solder with a melting point below 220°C.
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IHLP5050FDER1R2M01 Overview
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