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IHLP5050FDER4R7MA1 - Vishay

Description: • Shielded construction • Frequency range up to 5.0 MHz • Lowest DCR/μH, in this package size • Handles high transient current spikes without saturation

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IHLP5050FDER4R7MA1 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IHLP5050*
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IHLP5050FDER4R7MA1 - Vishay  - 3D model - Inductors Precision Moulded - IHLP5050*
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IHLP5050FDER4R7MA1 Details

  • Manufacturer Part Number:

    IHLP5050FDER4R7MA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    5251

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0112 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    6.4 mm

  • Package Length:

    13.259 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    13.5 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050FDER4R7MA1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP5050FDER4R7MA1 is a rectangular pad with a length of 5.5 mm, a width of 5.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
  • The IHLP5050FDER4R7MA1 has a maximum operating temperature of 125°C. To handle thermal derating, ensure that the inductor is operated within the recommended temperature range, and consider using a heat sink or thermal interface material to reduce the temperature rise. You can also use thermal simulation tools to estimate the temperature rise and optimize the design accordingly.
  • The self-resonant frequency of the IHLP5050FDER4R7MA1 is not explicitly stated in the datasheet. However, it can be estimated using the inductor's inductance and capacitance values. For the IHLP5050FDER4R7MA1, the self-resonant frequency is approximately 150 MHz.
  • Yes, the IHLP5050FDER4R7MA1 is suitable for high-reliability applications. It is built with a robust construction and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the inductor's reliability in your specific application.
  • To ensure magnetic shielding in a densely populated PCB, keep the IHLP5050FDER4R7MA1 at least 2 mm away from other components that may be affected by the inductor's magnetic field. You can also use magnetic shielding materials or mu-metal shielding to reduce the magnetic field's impact on nearby components.

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IHLP5050FDER4R7MA1 Overview

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