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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP5050FDER6R8M01
- Part Number IHLP5050FDER6R8M01
- Manufacturer Vishay
- Pin Count 2
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP5050FDER6R8M01 Details
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Manufacturer Part Number:
IHLP5050FDER6R8M01
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Israel, Mainland China, Mexico
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
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Case/Size Code:
5050
IHLP5050FDER6R8M01 Frequently Asked Questions (FAQs)
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The recommended land pattern for the IHLP5050FDER6R8M01 is a rectangular pad with a size of 5.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.
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The IHLP5050FDER6R8M01 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a thermal interface material (TIM) to improve heat transfer between the inductor and the PCB.
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The SRF of the IHLP5050FDER6R8M01 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. A rough estimate can be made using the formula: SRF ≈ 1 / (2 * π * sqrt(L * C)), where L is the inductance and C is the capacitance.
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The IHLP5050FDER6R8M01 is designed for high-frequency applications, but its performance may degrade above 100 MHz. Be sure to evaluate the inductor's impedance and loss characteristics at the specific frequency of interest.
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Follow the recommended soldering profile for the IHLP5050FDER6R8M01, which includes a peak temperature of 260°C and a soldering time of 3-5 seconds. Ensure the PCB is clean and free of oxidation, and use a solder with a melting point below 220°C.
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IHLP5050FDER6R8M01 Overview
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