The recommended land pattern for IHLP5050FDER6R8M51 is a rectangular pad with a size of 5.5 mm x 5.5 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
Handle the component by the edges or the body, avoiding touching the terminations or the core. Use ESD-safe materials and tools to prevent electrostatic discharge damage. Avoid bending, flexing, or twisting the component during assembly.
The maximum allowable voltage derating for IHLP5050FDER6R8M51 is 10% of the rated voltage. For example, if the rated voltage is 50 V, the maximum allowable voltage derating is 5 V.
IHLP5050FDER6R8M51 is rated for operation up to 125°C. However, the component's performance and lifespan may be affected at high temperatures. Consult the datasheet and application notes for guidance on high-temperature operation.
Ensure the component is properly soldered by following the recommended soldering profile, using a solder with a melting point below 260°C, and applying a sufficient amount of solder to the pads. Avoid overheating the component during soldering.
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IHLP5050FDER6R8M51 Overview
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