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IHLP5050FDERR15M01 - Vishay

Description: Vishay IHLP5050FD-01 Series Shielded Wire-wound SMD Inductor 0.15 μH ±20% 55A Idc

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IHLP5050FDERR15M01 - Vishay - PCB symbol
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PCB Footprints
IHLP5050FDERR15M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IHLP-5050FD-01
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3D Models
IHLP5050FDERR15M01 - Vishay - 3D model - Inductors Precision Moulded - IHLP-5050FD-01
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IHLP5050FDERR15M01 Details

  • Manufacturer Part Number:

    IHLP5050FDERR15M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.7

  • Case/Size Code:

    5050

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0006 Ω

  • Inductance-Nom (L):

    0.15 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    6.4 mm

  • Package Length:

    13.2 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    55 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050FDERR15M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IHLP5050FDERR15M01 is a rectangular pad with dimensions of 5.5 mm x 5.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
  • To ensure proper thermal management, it is recommended to provide a thermal path from the inductor to a heat sink or a large copper area on the PCB. The thermal pad on the inductor should be connected to a thermal via or a copper pour on the PCB, and the heat sink or copper area should be designed to dissipate the heat generated by the inductor.
  • The maximum operating temperature range for IHLP5050FDERR15M01 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
  • Yes, IHLP5050FDERR15M01 is compatible with lead-free soldering. The inductor is RoHS-compliant and can be soldered using lead-free soldering processes.
  • The recommended reflow profile for IHLP5050FDERR15M01 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The ramp rate should be 3°C/second or less.

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IHLP5050FDERR15M01 Overview

Use the download button to access the IHLP5050FDERR15M01 schematic symbol, PCB footprint, and 3D model.
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Part Image IHLP5050FDERR15MA1 Vishay Dale

General Fixed Inductor, 1 ELEMENT, 0.15 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 5050, GREEN