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IHLP6767GZER1R0M51 - Vishay

Description: 1 µH Shielded Molded Inductor 53 A 1.46mOhm Max Nonstandard

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IHLP6767GZER1R0M51 - Vishay - PCB symbol
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IHLP6767GZER1R0M51 - Vishay PCB footprint - Other - Other - IHLP6767GZER1R0M51-2
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IHLP6767GZER1R0M51 - Vishay - 3D model - Other - IHLP6767GZER1R0M51-2
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IHLP6767GZER1R0M51 Details

  • Manufacturer Part Number:

    IHLP6767GZER1R0M51

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    6767

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.00146 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    7 mm

  • Package Length:

    17.15 mm

  • Package Style:

    SMT

  • Package Width:

    17.15 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    53 A

  • Self Resonance Frequency:

    35.5 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP6767GZER1R0M51 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP6767GZER1R0M51 is a rectangular pad with a length of 6.5mm, a width of 5.5mm, and a thickness of 0.5mm. The pad should have a non-solder mask defined (NSMD) pad shape with a minimum of 0.5mm clearance around the pad.
  • The IHLP6767GZER1R0M51 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be mounted on a PCB with a thermal via or a thermal pad to dissipate heat. The surrounding components should also be chosen to ensure that they do not exceed their maximum operating temperatures.
  • The recommended soldering process for the IHLP6767GZER1R0M51 is a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. The inductor should be soldered using a solder with a melting point of 217°C or higher.
  • The IHLP6767GZER1R0M51 meets the required safety standards for UL (UL 94V-0) and IEC (IEC 60068-2-21). To ensure compliance, the inductor should be used in accordance with the recommended PCB layout, soldering process, and operating conditions.
  • The equivalent series resistance (ESR) of the IHLP6767GZER1R0M51 is 0.015 ohms at 100 kHz. This value is important to consider when designing the inductor into a circuit, as it affects the overall impedance and power loss.

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IHLP6767GZER1R0M51 Overview

Use the download button to access the IHLP6767GZER1R0M51 schematic symbol, PCB footprint, and 3D model.
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