IHLP8787MZER100M51 footprint, schematic symbol and 3D model by Vishay

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IHLP8787MZER100M51 Details

The recommended PCB footprint for the IHLP8787MZER100M51 is a rectangular pad with a length of 4.5mm, a width of 3.5mm, and a thickness of 0.5mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
The IHLP8787MZER100M51 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be mounted on a PCB with a thermal via or a thermal pad to dissipate heat. The surrounding components should also be chosen to minimize thermal interference.
The recommended soldering process for the IHLP8787MZER100M51 is a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. The inductor should be soldered using a solder with a melting point of 217°C or higher.
To ensure the IHLP8787MZER100M51 meets the required impedance specifications, the inductor should be used in a circuit with a maximum operating frequency of 1 MHz. The inductor should also be used with a suitable capacitor to form a resonant circuit, and the impedance should be measured using an impedance analyzer or a network analyzer.
The IHLP8787MZER100M51 should be stored in a dry, cool place away from direct sunlight and moisture. The inductor should be handled using anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage.

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