The recommended PCB footprint for the IHLP8787MZER2R2M51 is a rectangular pad with a length of 4.5 mm, a width of 3.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
The IHLP8787MZER2R2M51 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be mounted on a PCB with a thermal via or a thermal pad to dissipate heat. Additionally, the surrounding components should be kept at a safe distance to prevent thermal interference.
The self-resonant frequency of the IHLP8787MZER2R2M51 is not explicitly stated in the datasheet. However, based on the inductor's characteristics, the self-resonant frequency is typically in the range of 100-200 MHz. This frequency should be taken into account when designing the circuit to avoid unwanted resonances.
The IHLP8787MZER2R2M51 is designed to withstand moderate vibration levels. However, if the application involves extreme vibration, additional mechanical support or potting may be necessary to ensure the inductor's reliability.
To ensure proper soldering, the IHLP8787MZER2R2M51 should be soldered using a soldering iron with a temperature of 250-260°C. The soldering time should be limited to 3-5 seconds to prevent overheating. A solder with a melting point of 180-190°C should be used.
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IHLP8787MZER2R2M51 Overview
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