The recommended PCB footprint for IHLP8787MZER3R3M51 is a rectangular pad with dimensions of 12.5 mm x 10.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) thermal pad.
To ensure proper thermal management, it is recommended to provide a solid copper plane under the inductor, and to use thermal vias to connect the plane to the thermal pad on the inductor. The copper plane should be at least 1 oz thick and should be connected to a heat sink or a thermal management system.
The maximum operating temperature range for IHLP8787MZER3R3M51 is -40°C to +125°C. However, the inductor's performance may degrade at temperatures above 100°C, and it is recommended to derate the current rating accordingly.
Yes, IHLP8787MZER3R3M51 is designed to withstand high-vibration environments. However, it is recommended to follow proper mounting and soldering techniques to ensure the inductor is securely attached to the PCB. Additionally, it is recommended to perform vibration testing to ensure the inductor meets the specific requirements of the application.
To select the correct inductor value, you need to consider the operating frequency, current rating, and inductance value required for your application. You can use Vishay's online inductor selection tool or consult with a Vishay application engineer to determine the best inductor value for your specific application.
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IHLP8787MZER3R3M51 Overview
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