The recommended PCB footprint for IHLP8787MZER4R7M51 is a rectangular pad with dimensions of 12.5 mm x 10.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) thermal pad.
To ensure proper thermal management, it is recommended to provide a solid copper plane under the inductor, and to use thermal vias to connect the plane to the thermal pad on the inductor. The copper plane should be at least 1 oz thick and should be connected to a heat sink or a thermal management system.
The maximum operating temperature range for IHLP8787MZER4R7M51 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
Yes, IHLP8787MZER4R7M51 is compatible with lead-free soldering. The inductor is RoHS-compliant and can be soldered using lead-free soldering processes.
The recommended reflow profile for IHLP8787MZER4R7M51 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The ramp rate should be 3°C/second or less.
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IHLP8787MZER4R7M51 Overview
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