The recommended PCB footprint for the IHLP8787MZER750M51 is a rectangular pad with a length of 12.7 mm, a width of 10.2 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape with a minimum of 0.5 mm clearance from the edge of the pad to the edge of the PCB.
The IHLP8787MZER750M51 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be mounted on a PCB with a thermal conductivity of at least 1 W/m-K. Additionally, the inductor should be placed at least 2 mm away from any heat sources, and the PCB should have adequate thermal vias to dissipate heat.
The recommended soldering process for the IHLP8787MZER750M51 is a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. The inductor should be placed on the PCB using a solder paste with a melting point of 217°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
The IHLP8787MZER750M51 meets the required safety standards for UL 94V-0 and IEC 62133. To ensure compliance, the inductor should be used in accordance with the recommended PCB layout and soldering process. Additionally, the inductor should be used in a system that meets the required safety standards for the intended application.
The IHLP8787MZER750M51 should be stored in a dry, cool place away from direct sunlight. The inductor should be handled with care to prevent mechanical damage, and it should be stored in its original packaging or a similar anti-static package. The inductor should not be exposed to temperatures above 40°C or humidity above 80%.
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IHLP8787MZER750M51 Overview
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