The recommended PCB footprint for the IHV20EB200 is a rectangular pad with a minimum size of 5.5 mm x 3.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined area of 0.5 mm around the thermal pad.
To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. The heat sink should be designed to provide a thermal resistance of less than 10°C/W. Additionally, ensure good airflow around the device and heat sink.
The maximum allowed voltage derating for the IHV20EB200 is 80% of the maximum rated voltage. This means that if the maximum rated voltage is 200 V, the maximum allowed voltage derating would be 160 V.
Yes, the IHV20EB200 is suitable for high-frequency switching applications up to 100 kHz. However, it is essential to consider the device's switching losses, thermal management, and PCB layout to ensure reliable operation.
To handle the IHV20EB200's high peak current capability, ensure that the PCB traces and vias are designed to handle high currents. Use thick copper traces (at least 2 oz) and multiple vias to reduce the current density. Additionally, consider using a current sense resistor to monitor the current and prevent overcurrent conditions.
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IHV20EB200 Overview
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