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IL1209S - XP POWER

Description: Isolated DC/DC Converters DC-DC, 2W, unreg., single output, SIP

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PCB Footprints
IL1209S - XP POWER PCB footprint - Other - Other - IL1209S-1
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3D Models
IL1209S - XP POWER  - 3D model - Other - IL1209S-1
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IL1209S Details

  • Manufacturer Part Number:

    IL1209S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Package Description:

    SIP-4

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    XP Power

  • YTEOL:

    6

  • Additional Feature:

    LG-MAX

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    13.2 V

  • Input Voltage-Min:

    10.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XSMA-T4

  • Length:

    11.68 mm

  • Load Regulation-Max:

    10%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.222 A

  • Output Voltage-Max:

    9.27 V

  • Output Voltage-Min:

    8.73 V

  • Output Voltage-Nom:

    9 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Equivalence Code:

    SIP4,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    10.16 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    2 W

  • Trim/Adjustable Output:

    NO

  • Width:

    7.5 mm

IL1209S Frequently Asked Questions (FAQs)

  • XP Power recommends a PCB layout with a large copper area connected to the tab of the device to dissipate heat efficiently. A minimum of 1 square inch of copper is recommended.
  • XP Power recommends using a soldering iron with a temperature of 250°C to 270°C and a solder with a melting point of 180°C to 200°C. The device should be soldered within 3 seconds to prevent thermal damage.
  • The IL1209S can operate up to 80% of its maximum rated voltage without derating. However, for reliable operation, XP Power recommends derating the voltage by 10% to 15% to ensure optimal performance and reliability.
  • The IL1209S is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, XP Power offers a conformal coating option to improve the device's moisture resistance. Contact XP Power for more information.
  • XP Power recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, depending on the input voltage and output current requirements. The capacitor should be placed as close to the device as possible to minimize noise and ripple.

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IL1209S Overview

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