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IL300-F-X007 - Vishay

Description: Optocoupler DC-IN 1-CH Linear Photovoltaic DC-OUT 8-Pin PDIP-8A SMD

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PCB Footprints
IL300-F-X007 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SMD-8 Option 7-ren1
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3D Models
IL300-F-X007 - Vishay  - 3D model - Small Outline Packages - SMD-8 Option 7-ren1
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IL300-F-X007 Details

  • Manufacturer Part Number:

    IL300-F-X007

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, SMD, 8 PIN

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • Configuration:

    DUAL, SIMULTANEOUS OPERATION

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    OPTOELECTRONIC DEVICE

  • Power Dissipation-Max:

    0.05 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

IL300-F-X007 Frequently Asked Questions (FAQs)

  • The recommended storage condition for IL300-F-X007 is in a dry, cool place, away from direct sunlight and moisture, with a temperature range of -40°C to 125°C.
  • Yes, IL300-F-X007 is designed to withstand high-vibration environments, but it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure proper mounting and securing of the device.
  • To prevent electrostatic discharge (ESD) damage, handle IL300-F-X007 with ESD-protective equipment, such as wrist straps, mats, and bags, and follow proper ESD handling procedures.
  • The recommended soldering temperature profile for IL300-F-X007 is a peak temperature of 260°C for a maximum of 10 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second.
  • IL300-F-X007 is designed to operate in environments with relative humidity up to 95%, but it's recommended to follow the manufacturer's guidelines for humidity testing and to ensure proper sealing and encapsulation of the device.

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