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IL300-X009T - Vishay

Description: High Linearity Optocouplers Single Linear, High Gain, Wide Bandwidth

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IL300-X009T - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - IL300-X009T-1
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3D Models
IL300-X009T - Vishay  - 3D model - Small Outline Packages - IL300-X009T-1
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IL300-X009T Details

  • Manufacturer Part Number:

    IL300-X009T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    OPTOELECTRONIC DEVICE

  • Power Dissipation-Max:

    0.05 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

IL300-X009T Frequently Asked Questions (FAQs)

  • Vishay provides a recommended PCB layout and land pattern in their application note AN10343, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal performance and reliability.
  • To prevent damage during assembly and testing, it's recommended to use a current-limited power supply and to avoid applying high currents (>10A) for extended periods. Additionally, ensure that the device is properly soldered and that the PCB is designed to handle high currents.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to 100°C for optimal performance.
  • Yes, the IL300-X009T is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the vibration levels. Additionally, consider using a vibration-resistant soldering process and materials.
  • To prevent ESD damage, it's recommended to handle the device in an ESD-protected environment, use ESD-protective packaging and materials, and follow proper ESD-handling procedures. Additionally, ensure that the device is properly grounded during assembly and testing.

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IL300-X009T Overview

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