SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Qualification Status:
Not Qualified
Seated Height-Max:
1.7 mm
Supply Current-Max:
0.7 mA
Supply Voltage-Max:
45 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
24 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
3.9 mm
ILD1151 Frequently Asked Questions (FAQs)
Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using a heat sink or thermal interface material to reduce the thermal resistance between the device and the ambient environment.
Although the datasheet specifies the recommended operating voltage range, it's essential to note that the absolute maximum rating for the input pins is 7V. Exceeding this voltage can cause permanent damage to the device.
To prevent electrostatic discharge (ESD) damage, handle the devices with ESD-protective equipment, such as wrist straps or mats. During assembly, ensure that the PCB and components are properly grounded, and consider using ESD-protective packaging materials.
Infineon recommends soldering the ILD1151 using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Hand soldering is not recommended due to the risk of overheating the device.
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ILD1151 Overview
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