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ILN2003AN - Semic

Description: FOD814A300W

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ILN2003AN - Semic PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - ILN2003AN
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ILN2003AN Details

  • Manufacturer Part Number:

    ILN2003AN

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • Manufacturer:

    IKSemicon Co Ltd

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    COMPLEX

  • JESD-30 Code:

    R-PDIP-T16

  • Number of Elements:

    7

  • Number of Terminals:

    16

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ILN2003AN Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Handle the device with ESD-protective equipment and follow proper ESD-handling procedures. Use an ESD-protective bag or container for storage and transportation.
  • A 10nF to 100nF input capacitance is recommended to filter out high-frequency noise and ensure stable operation.

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