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ILSB0805ERR33K - Vishay

Description: Inductor RF Chip Shielded Multi-Layer 330nH 10% 25MHz 20Q-Factor 250mA 550mOhm DCR 0805 T/R

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PCB Footprints
ILSB0805ERR33K - Vishay PCB footprint - Inductors Chip - Inductors Chip - ILSB0805_1.1
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3D Models
ILSB0805ERR33K - Vishay  - 3D model - Inductors Chip - ILSB0805_1.1
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ILSB0805ERR33K Details

  • Manufacturer Part Number:

    ILSB0805ERR33K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.55 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.9 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.25 A

  • Self Resonance Frequency:

    167 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    10%

ILSB0805ERR33K Frequently Asked Questions (FAQs)

  • The recommended land pattern for ILSB0805ERR33K is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. It's recommended to follow the IPC-7351 standard for land pattern design.
  • ILSB0805ERR33K is rated for operation up to 150°C, but it's recommended to derate the power rating above 125°C. It's also important to consider the thermal resistance of the component and the PCB when operating in high-temperature environments.
  • ILSB0805ERR33K is an ESD-sensitive device, and it's recommended to handle it with ESD-protective equipment and follow proper ESD-handling procedures. It's also recommended to use ESD-protection devices or circuits in the design to prevent ESD damage.
  • ILSB0805ERR33K should be stored in a dry, cool place with a temperature range of -40°C to 30°C and a relative humidity of 60% or less. It's recommended to store the components in their original packaging or in a sealed bag to prevent moisture absorption.
  • ILSB0805ERR33K is a surface-mount device, and it's recommended to follow proper mounting and soldering procedures to ensure reliable operation in high-vibration environments. It's also recommended to consider the mechanical stress and vibration resistance of the component and the PCB in the design.

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ILSB0805ERR33K Overview

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Part Image CTML0805F-R33K Central Technologies

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