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ILSB1206ER1R5K - Vishay

Description: 1.5 µH Shielded Multilayer Inductor 50 mA 500mOhm Max 1206 (3216 Metric)

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PCB Footprints
ILSB1206ER1R5K - Vishay PCB footprint - Inductors Chip - Inductors Chip - 1206
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3D Models
ILSB1206ER1R5K - Vishay  - 3D model - Inductors Chip - 1206
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ILSB1206ER1R5K Details

  • Manufacturer Part Number:

    ILSB1206ER1R5K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.7

  • Case/Size Code:

    1206

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.5 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.1 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.05 A

  • Self Resonance Frequency:

    69 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

ILSB1206ER1R5K Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ILSB1206ER1R5K is a rectangular pad with a size of 1.3 mm x 1.3 mm, with a solder mask clearance of 0.1 mm. This can be found in the Vishay Intertechnologies' recommended land pattern document.
  • The ILSB1206ER1R5K has a maximum operating temperature of 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • Yes, the ILSB1206ER1R5K is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's crucial to follow the recommended soldering profile to prevent damage to the component.
  • The typical power derating curve for the ILSB1206ER1R5K can be found in the Vishay Intertechnologies' application note AN10343. The curve shows the maximum power rating of the component at different ambient temperatures.
  • The ILSB1206ER1R5K has a moisture sensitivity level (MSL) of 1, which means it can withstand high-humidity environments. However, it's still essential to follow proper handling and storage procedures to prevent moisture-related damage.

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ILSB1206ER1R5K Overview

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Part Image CIL31J1R5KBC Samsung Electro-Mechanics

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Part Image CIL31J1R5KAE Samsung Electro-Mechanics

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Part Image CIL31J1R5KBE Samsung Electro-Mechanics

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