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IMBD4148-E3-08 - Vishay

Description: VISHAY - IMBD4148-E3-08 - SWITCHING DIODE GENPURP SOT23-E3 09X4345

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IMBD4148-E3-08 - Vishay - PCB symbol
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PCB Footprints
IMBD4148-E3-08 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren6
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3D Models
IMBD4148-E3-08 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23-ren6
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IMBD4148-E3-08 Details

  • Manufacturer Part Number:

    IMBD4148-E3-08

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.35 W

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

IMBD4148-E3-08 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat effectively. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is recommended to derate the power handling of the device, ensure good thermal design and heat sinking, and consider using a thermally conductive interface material between the device and heat sink.
  • The IMBD4148-E3-08 is a sensitive semiconductor device and requires proper ESD protection during handling and assembly. It is recommended to follow standard ESD handling precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging.
  • The IMBD4148-E3-08 is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. It is recommended to consult with Vishay Intertechnologies for availability of high-reliability or aerospace-grade versions of the device.
  • The recommended soldering conditions for the IMBD4148-E3-08 are a peak temperature of 260°C, with a soldering time of 10-15 seconds. It is recommended to follow the IPC J-STD-020 standard for soldering electronic components.

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IMBD4148-E3-08 Overview

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IMBD4148-E3-08 Alternates

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For a full list of alternate parts for IMBD4148-E3-08, check out Findchips.com