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IMC1008ER10NJ - Vishay

Description: RF Inductors - SMD 10nH 5%

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IMC1008ER10NJ Details

  • Manufacturer Part Number:

    IMC1008ER10NJ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.08 Ω

  • Inductance-Nom (L):

    0.01 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.6 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    1 A

  • Self Resonance Frequency:

    4300 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    Q IS MEASURED AT 1000 MHZ

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

IMC1008ER10NJ Frequently Asked Questions (FAQs)

  • The recommended land pattern for the IMC1008ER10NJ is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the IMC1008ER10NJ is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in your design. Ensure that the component is not exposed to temperatures above 150°C for extended periods, and provide adequate heat dissipation to prevent thermal runaway.
  • The IMC1008ER10NJ is an ESD-sensitive device. To prevent damage, handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that your manufacturing process and storage facilities are ESD-compliant.
  • The recommended soldering profile for the IMC1008ER10NJ is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that your soldering process is within these parameters to prevent damage to the component.
  • The IMC1008ER10NJ is a moisture-sensitive device. To prevent damage, ensure that the component is stored and operated in a dry environment with a relative humidity below 60%. If exposure to moisture is unavoidable, consider using a conformal coating or potting compound to protect the device.

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IMC1008ER10NJ Overview

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Part Image MRFI1008-10NGT VENKEL LTD

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