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INN3270C-H215-TL - Power Integrations

Description: AC/DC Converters Off-Line CV/CC 100W 750V FET 14A PowiGaN

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INN3270C-H215-TL - Power Integrations PCB footprint - Other - Other - INN3270C-H215-TL-5
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INN3270C-H215-TL Details

  • Manufacturer Part Number:

    INN3270C-H215-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-08-01

  • Manufacturer:

    Power Integrations

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Moisture Sensitivity Level:

    3

INN3270C-H215-TL Frequently Asked Questions (FAQs)

  • Power Integrations provides a recommended PCB layout in their application notes (e.g., AN-63) and evaluation board designs. It's essential to follow these guidelines to ensure optimal thermal performance and minimize thermal resistance.
  • The input capacitor selection depends on the input voltage, current, and ripple requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value that ensures the ripple voltage is within the specified limits. Power Integrations also provides guidance on capacitor selection in their application notes.
  • The output pins of the INN3270C-H215-TL can withstand a maximum voltage stress of 40 V during startup or fault conditions. However, it's essential to ensure that the output voltage does not exceed this limit to prevent damage to the IC or other components in the circuit.
  • The INN3270C-H215-TL has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage source. The OVP threshold is typically set to 1.5 times the nominal output voltage. Additionally, external OVP circuits can be implemented using zener diodes, resistors, and comparators to provide additional protection.
  • The heatsink design depends on the specific application and thermal requirements. Power Integrations provides guidelines for heatsink design in their application notes, including recommendations for thermal interface materials, heatsink geometry, and airflow considerations.

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