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IP4856CX25/C - NXP

Description: Memory Card Interface 25-WLCSP (2.05x2.05)

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PCB Footprints
IP4856CX25/C - NXP PCB footprint - BGA - BGA - WLCSP25
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3D Models
IP4856CX25/C - NXP  - 3D model - BGA - WLCSP25
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IP4856CX25/C Details

  • Manufacturer Part Number:

    IP4856CX25/C

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    WLCSP-25

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PBGA-B25

  • Length:

    2.05 mm

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    2.9 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2.05 mm

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IP4856CX25/C Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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