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IPB50N10S3L16ATMA1 - Infineon

Description: IPB50N10S3L16ATMA1 N-Channel MOSFET, 50 A, 100 V OptiMOS T, 3-Pin D2PAK Infineon

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IPB50N10S3L16ATMA1 - Infineon PCB footprint - Other - Other - PG-TO263-3-2_1
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IPB50N10S3L16ATMA1 - Infineon  - 3D model - Other - PG-TO263-3-2_1
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IPB50N10S3L16ATMA1 Details

  • Manufacturer Part Number:

    IPB50N10S3L16ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-263, 3/2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    330 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0206 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    100 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Reference Standard:

    AEC-Q101; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPB50N10S3L16ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPB50N10S3L16ATMA1 is -40°C to 150°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of ≤ 1.5 K/W, and ensuring good thermal contact between the IGBT and heat sink.
  • The recommended gate resistor value for IPB50N10S3L16ATMA1 is between 10 Ω to 100 Ω, depending on the specific application and switching frequency.
  • Yes, IPB50N10S3L16ATMA1 can be used in a parallel configuration, but it's essential to ensure that the gate drive signals are synchronized and the IGBTs are matched in terms of threshold voltage and transconductance.
  • The maximum allowable voltage transient for IPB50N10S3L16ATMA1 is ±10% of the maximum rated voltage, with a maximum duration of 100 μs.

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IPB50N10S3L16ATMA1 Overview

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Part Image IPB50N10S3L-16 Infineon Technologies AG

Power Field-Effect Transistor, 50A I(D), 100V, 0.0206ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB