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IPB720P15LMATMA1 - Infineon

Description: P-Channel 150 V 4.6A (Ta), 41A (Tc) 3.8W (Ta), 300W (Tc) Surface Mount PG-TO263-3

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IPB720P15LMATMA1 - Infineon PCB footprint - Other - Other - IPB720P15LMATMA1-2
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IPB720P15LMATMA1 Details

  • Manufacturer Part Number:

    IPB720P15LMATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia, Mexico

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    2020 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    41 A

  • Drain-source On Resistance-Max:

    0.072 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    110 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    164 A

  • Reference Standard:

    IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPB720P15LMATMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure good airflow around the device, use a heat sink if possible, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink. Monitor the device's junction temperature (Tj) to ensure it remains within the recommended operating range.
  • Infineon recommends a gate drive voltage of 15 V to ensure optimal switching performance and minimize power losses. However, the device can operate with a gate drive voltage as low as 10 V, but with reduced performance.
  • Use a suitable overvoltage protection (OVP) circuit to prevent voltage spikes from damaging the device. Implement overcurrent protection (OCP) using a current sense resistor and a comparator to detect excessive currents. Consider using a dedicated protection IC for added reliability.
  • Infineon recommends a dead time of at least 100 ns to ensure proper switching and minimize power losses. However, the optimal dead time may vary depending on the specific application and switching frequency.

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