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IPD26N06S2L-35 - Infineon

Description: Trans MOSFET N-CH 55V 30A 3-Pin TO-252 T/R

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IPD26N06S2L-35 - Infineon PCB footprint - Other - Other - PG-TO252-3-11_2021-1
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IPD26N06S2L-35 Details

  • Manufacturer Part Number:

    IPD26N06S2L-35

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    9

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.047 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    68 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD26N06S2L-35 Frequently Asked Questions (FAQs)

  • The IPD26N06S2L-35 can operate from -40°C to 150°C, but the maximum junction temperature (Tj) should not exceed 150°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of less than 10 K/W, and ensuring good thermal contact between the device and the heat sink.
  • A recommended PCB layout for the IPD26N06S2L-35 includes a solid ground plane, short and wide traces for the drain and source pins, and a decoupling capacitor between the drain and source pins.
  • Yes, the IPD26N06S2L-35 is suitable for high-frequency switching applications up to 100 kHz, but the user should ensure that the device is properly cooled and the PCB layout is optimized for high-frequency operation.
  • ESD protection can be achieved by using ESD protection devices, such as TVS diodes, and following proper handling and storage procedures for the device.

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IPD26N06S2L-35 Overview

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