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IPD50R380CEAUMA1 - Infineon

Description: Infineon IPD50R380CEAUMA1 N-channel MOSFET, 14.1 A, 550 V CoolMOS CE, 3-Pin TO-252

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IPD50R380CEAUMA1 - Infineon - PCB symbol
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PCB Footprints
IPD50R380CEAUMA1 - Infineon PCB footprint - Other - Other - PG-TO252 -3_ffw_1
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3D Models
IPD50R380CEAUMA1 - Infineon - 3D model - Other - PG-TO252 -3_ffw_1
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IPD50R380CEAUMA1 Details

  • Manufacturer Part Number:

    IPD50R380CEAUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    173 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain-source On Resistance-Max:

    0.38 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    32.4 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD50R380CEAUMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPD50R380CEAUMA1 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal design and layout guidelines, and to implement adequate cooling mechanisms, such as heat sinks or thermal interfaces.
  • The recommended PCB layout and design considerations include using a multi-layer PCB, placing decoupling capacitors close to the device, and ensuring good thermal conductivity and heat dissipation.
  • To handle the high current and power dissipation requirements, it's essential to use a robust power supply, implement adequate heat sinking and thermal management, and ensure proper PCB design and layout.
  • The IPD50R380CEAUMA1 is an ESD-sensitive device, and handling precautions include using anti-static wrist straps, mats, and packaging, as well as following proper handling and storage procedures.

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IPD50R380CEAUMA1 Overview

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