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IPD90P04P405ATMA1 - Infineon

Description: MOSFET P-Ch -40V -90A DPAK-2 OptiMOS-P2

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IPD90P04P405ATMA1 - Infineon PCB footprint - Other - Other - PG-TO252-3-11_FFW
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3D Models
IPD90P04P405ATMA1 - Infineon  - 3D model - Other - PG-TO252-3-11_FFW
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IPD90P04P405ATMA1 Details

  • Manufacturer Part Number:

    IPD90P04P405ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.0047 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    360 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPD90P04P405ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPD90P04P405ATMA1 is -40°C to 150°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of ≤ 10 K/W, and ensuring good airflow around the device.
  • A recommended PCB layout for IPD90P04P405ATMA1 includes a solid ground plane, short and wide traces for power and ground, and a thermal relief pattern for the heat sink.
  • Yes, IPD90P04P405ATMA1 is suitable for high-reliability applications, such as automotive and industrial systems, due to its robust design and manufacturing process.
  • Handle the device by the body, avoid touching the pins, and store it in an electrostatic discharge (ESD) protective package to prevent damage.

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