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IPD90P04P4L-04 - Infineon

Description: MOSFET P-Ch 90A 40V OptiMOS-P2 TO252 Infineon IPD90P04P4L-04 P-channel MOSFET Transistor, 90 A, -40 V, 3-Pin TO-252

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PCB Footprints
IPD90P04P4L-04 - Infineon PCB footprint - Other - Other - PG-TO252-3-11_FFW
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3D Models
IPD90P04P4L-04 - Infineon  - 3D model - Other - PG-TO252-3-11_FFW
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IPD90P04P4L-04 Details

  • Manufacturer Part Number:

    IPD90P04P4L-04

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.0043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    360 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPD90P04P4L-04 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPD90P04P4L-04 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing thermal resistance.
  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and design, including using a solid ground plane, minimizing track lengths, and using decoupling capacitors.
  • To prevent ESD damage, it's essential to follow proper handling and storage procedures, such as using ESD-protective packaging, grounding straps, and wrist straps.
  • For optimal soldering and rework, it's recommended to follow Infineon's guidelines, including using a soldering temperature of 260°C (max), a soldering time of 10 seconds (max), and using a rework station with a temperature-controlled soldering iron.

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IPD90P04P4L-04 Overview

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