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IPU95R3K7P7AKMA1 - Infineon

Description: MOSFET LOW POWER_NEW

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PCB Footprints
IPU95R3K7P7AKMA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PG-TO251-3-21
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3D Models
IPU95R3K7P7AKMA1 - Infineon  - 3D model - Transistor Outline, Vertical - PG-TO251-3-21
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IPU95R3K7P7AKMA1 Details

  • Manufacturer Part Number:

    IPU95R3K7P7AKMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    IPAK-3

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    2 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    950 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    3.7 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-251

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    22 W

  • Pulsed Drain Current-Max (IDM):

    5 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPU95R3K7P7AKMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for the IPU95R3K7P7AKMA1, which includes recommendations for PCB layout, thermal management, and heat sink design. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal dissipation.
  • Infineon provides a component selection guide in the datasheet, which includes recommended values and types for external components. Additionally, engineers can use online tools, such as capacitor and resistor calculators, to determine the optimal component values based on their specific application requirements.
  • Common failure modes for the IPU95R3K7P7AKMA1 include overvoltage, overcurrent, and overheating. To mitigate these risks, engineers should implement proper voltage regulation, current limiting, and thermal management strategies, such as using voltage supervisors, current sense resistors, and heat sinks.
  • Infineon provides EMC and EMI guidelines in the datasheet, which include recommendations for PCB layout, shielding, and filtering. Engineers should also follow industry standards, such as IEC 61000-4, and perform EMC and EMI testing to ensure compliance.
  • Infineon provides reliability data, including mean time to failure (MTTF) and failure rate, in the datasheet. Engineers should also consider environmental factors, such as temperature, humidity, and vibration, when estimating the component's lifetime and reliability in their specific application.

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IPU95R3K7P7AKMA1 Overview

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