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IR1167BSTRPBF - Infineon

Description: Infineon IR1167BSTRPBF MOSFET Power Driver, 7A 8-Pin, SOIC

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IR1167BSTRPBF Details

  • Manufacturer Part Number:

    IR1167BSTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    80 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    12 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.065 µs

  • Turn-on Time:

    0.08 µs

  • Width:

    3.9 mm

IR1167BSTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a thermal interface material (TIM) between the device and the heat sink. Also, follow the recommended operating temperature range and derating guidelines.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Adjust the gate resistor value, gate voltage, and dead-time settings based on the specific requirements of your application. Consult the datasheet and application notes for guidance on optimizing performance.
  • Follow proper PCB layout and routing guidelines to minimize EMI. Use shielding, filtering, and grounding techniques to reduce electromagnetic interference. Ensure compliance with relevant EMC standards and regulations.

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