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IR2106SPBF - Infineon

Description: HIGH AND LOW SIDE DRIVER

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IR2106SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - IRF7380TRPBF
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IR2106SPBF Details

  • Manufacturer Part Number:

    IR2106SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.3 µs

  • Width:

    3.9 mm

IR2106SPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2106SPBF is 500 kHz, but it can be operated up to 1 MHz with reduced performance.
  • To ensure the bootstrap capacitor is properly charged, make sure to provide a low-impedance path from the bootstrap pin to the high-side supply voltage (VCC) and use a capacitor with a sufficient capacitance value (typically 1-10 nF).
  • The SD (Shutdown) pin is used to disable the device and reduce power consumption. To use it, connect the SD pin to a logic low signal to shut down the device, and connect it to a logic high signal or leave it open to enable the device.
  • Choose gate resistor values based on the specific requirements of your application, considering factors such as switching frequency, gate charge, and power losses. A good starting point is to use the recommended values in the datasheet, and then adjust them based on your specific design requirements.
  • For optimal performance and thermal management, ensure good heat dissipation by using a thermally enhanced package, placing the device near a heat sink or thermal pad, and using a multi-layer PCB with a solid ground plane. Keep the high-current paths short and use a low-inductance layout to minimize EMI.

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IR2106SPBF Overview

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