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IR2130JPBF - Infineon

Description: Gate Drivers

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IR2130JPBF - Infineon PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - 44-lead plcc
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IR2130JPBF Details

  • Manufacturer Part Number:

    IR2130JPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    S-PQCC-J32

  • JESD-609 Code:

    e3

  • Length:

    16.585 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC44,.7SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.57 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.55 µs

  • Turn-on Time:

    0.85 µs

  • Width:

    16.585 mm

IR2130JPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2130JPBF is 600 kHz, but it can be adjusted up to 1 MHz with an external oscillator.
  • Proper thermal management can be achieved by providing a heat sink, ensuring good airflow, and keeping the device away from heat sources. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB to dissipate heat.
  • The recommended layout and routing for the IR2130JPBF involves keeping the high-frequency signals away from the low-frequency signals, using a solid ground plane, and minimizing the length of the traces to reduce electromagnetic interference (EMI).
  • The IR2130JPBF has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional protection can be achieved by using external voltage regulators and transient voltage suppressors (TVS) to protect against voltage spikes and surges.
  • The recommended input and output filtering for the IR2130JPBF involves using a pi-filter (C-L-C) or a T-filter (L-C-L) to reduce electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC).

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IR2130JPBF Overview

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