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IR2130STRPBF - Infineon

Description: INFINEON - IR2130STRPBF - MOSFET/IGBT DRIVER, 3-PH BRIDGE, WSOIC28

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IR2130STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead SOIC (wide body)
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IR2130STRPBF - Infineon  - 3D model - Small Outline Packages - 28-Lead SOIC (wide body)
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IR2130STRPBF Details

  • Manufacturer Part Number:

    IR2130STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.55 µs

  • Turn-on Time:

    0.85 µs

  • Width:

    7.5 mm

IR2130STRPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2130STRPBF is 600 kHz, but it can be operated up to 1 MHz with reduced performance.
  • Proper thermal management can be achieved by providing a heat sink, ensuring good airflow, and keeping the device away from heat sources. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB to dissipate heat.
  • The recommended dead time for the IR2130STRPBF is 100-200 ns, but it can be adjusted based on the specific application requirements.
  • Yes, the IR2130STRPBF can be used in a half-bridge configuration, but it requires an external bootstrap diode and a capacitor to generate the high-side gate drive voltage.
  • The IR2130STRPBF has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. Additionally, external protection circuits can be added to provide extra protection against voltage transients and spikes.

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IR2130STRPBF Overview

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