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IR2131SPBF - Infineon

Description: 3 HIGH SIDE AND 3 LOW SIDE DRIVER

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IR2131SPBF - Infineon - PCB symbol
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PCB Footprints
IR2131SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead SOIC (wide body)
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3D Models
IR2131SPBF - Infineon - 3D model - Small Outline Packages - 28-Lead SOIC (wide body)
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IR2131SPBF Details

  • Manufacturer Part Number:

    IR2131SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    1 µs

  • Turn-on Time:

    2 µs

  • Width:

    7.5 mm

IR2131SPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2131SPBF is 600 kHz, but it can be operated up to 1 MHz with reduced performance.
  • Proper thermal management can be achieved by providing a heat sink, ensuring good airflow, and keeping the device away from heat sources. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB to dissipate heat.
  • The recommended layout and routing for the IR2131SPBF involves keeping the high-frequency switching nodes (e.g., VCC, VIN, and SW) as short and wide as possible, and keeping the sensitive analog nodes (e.g., VREF and ISENSE) away from the switching nodes.
  • The dead time and blanking time in the IR2131SPBF can be handled by adjusting the DT and BT pins, respectively. The dead time should be set to ensure that the high-side and low-side FETs are not conducting simultaneously, and the blanking time should be set to ensure that the current sense signal is not distorted.
  • The VREF pin on the IR2131SPBF is used to set the internal voltage reference, which is used to regulate the output voltage. The VREF pin should be connected to a stable voltage source, such as a voltage regulator or a resistive divider.

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IR2131SPBF Overview

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For a full list of alternate parts for IR2131SPBF, check out Findchips.com