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IR21363JTRPBF - Infineon

Description: Gate Drivers 3Phs Drvr Sft Trn On Invrt 200ns

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IR21363JTRPBF - Infineon PCB footprint - Other - Other - IR21363JTRPBF-3
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IR21363JTRPBF - Infineon  - 3D model - Other - IR21363JTRPBF-3
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IR21363JTRPBF Details

  • Manufacturer Part Number:

    IR21363JTRPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MS-018AC, LCC-44/32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.81

  • Additional Feature:

    FLOATING LOAD DRIVER; UNDER VOLTAGE LOCKOUT CIRCUIT

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PQCC-J32

  • Length:

    16.585 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Seated Height-Max:

    4.57 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    12 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Turn-off Time:

    0.55 µs

  • Turn-on Time:

    0.55 µs

  • Width:

    16.585 mm

IR21363JTRPBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance can be found in the application note AN-978, which provides guidelines for PCB design, component placement, and thermal management.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal design guidelines provided in the datasheet, including proper heat sinking, thermal interface material selection, and derating the device's power handling capability according to the temperature rating.
  • The recommended gate drive voltage and current levels can be found in the datasheet, but as a general guideline, a gate drive voltage of 10-15V and a current of 1-2A is typically recommended for optimal switching performance.
  • To troubleshoot issues with the device, it is recommended to follow a systematic approach, including checking the power supply, input signals, and output waveforms, as well as verifying the device's configuration and programming. The device's fault detection and protection features can also provide valuable information for troubleshooting.
  • When using the device in a high-reliability or safety-critical application, it is essential to follow the recommended design and testing guidelines, including fault tree analysis, failure mode and effects analysis (FMEA), and compliance with relevant industry standards and regulations.

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IR21363JTRPBF Overview

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