IR2233JTRPBF footprint, schematic symbol and 3D model by Infineon

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IR2233JTRPBF Details

Manufacturer Part Number:
IR2233JTRPBF
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MS-018AC, LCC-44/32
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
20 Weeks
Manufacturer:
Infineon Technologies AG
YTEOL:
6.81
Additional Feature:
FLOATING LOAD DRIVER; UNDER VOLTAGE LOCKOUT CIRCUIT
High Side Driver:
YES
Input Characteristics:
STANDARD
Interface IC Type:
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code:
S-PQCC-J32
Length:
16.585 mm
Moisture Sensitivity Level:
3
Number of Functions:
3
Number of Terminals:
32
Operating Temperature-Max:
125 °C
Output Characteristics:
STANDARD
Output Peak Current Limit-Nom:
0.5 A
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
QCCJ
Package Equivalence Code:
LDCC44,.7SQ
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
4.57 mm
Supply Voltage-Max:
20 V
Supply Voltage-Min:
10 V
Supply Voltage-Nom:
15 V
Supply Voltage1-Max:
620 V
Supply Voltage1-Min:
5 V
Supply Voltage1-Nom:
15 V
Surface Mount:
YES
Technology:
BICMOS
Terminal Form:
J BEND
Terminal Pitch:
1.27 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
0.95 µs
Turn-on Time:
1 µs
Width:
16.585 mm

The maximum operating temperature range for the IR2233JTRPBF is -40°C to 150°C.
The bootstrap capacitor should be sized based on the maximum voltage and current requirements of the application. A general rule of thumb is to use a capacitor with a value of at least 10nF to 22nF, with a voltage rating of 25V or higher.
The IR2233JTRPBF should be placed close to the power MOSFETs, with the bootstrap capacitor and voltage regulator components placed nearby. The layout should minimize parasitic inductance and ensure good thermal dissipation.
The dead time and overlap control can be handled using external resistors and capacitors to set the dead time and overlap periods. The datasheet provides guidelines for calculating the required values.
Key considerations for EMI and EMC include using a shielded layout, minimizing loop areas, and using EMI filters and shielding to reduce radiated emissions.

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System Verified

Community Approved

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