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IR2235STRPBF - Infineon

Description: Gate Drivers 1200V 3-Phase,0.5A OCP, OPAMP, FAULT,SD

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IR2235STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - IR2235STRPBF   28pin soic
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IR2235STRPBF - Infineon  - 3D model - Small Outline Packages - IR2235STRPBF   28pin soic
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IR2235STRPBF Details

  • Manufacturer Part Number:

    IR2235STRPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MS-013AE, SOIC-28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.75

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    1220 V

  • Supply Voltage1-Min:

    8 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.95 µs

  • Turn-on Time:

    1 µs

  • Width:

    7.5 mm

IR2235STRPBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2235STRPBF is 500 kHz, but it can be operated up to 1 MHz with reduced performance.
  • Proper thermal management can be achieved by providing a heat sink with a thermal resistance of less than 10°C/W, and ensuring good airflow around the device. Additionally, the PCB layout should be designed to minimize thermal resistance.
  • The recommended dead time for the IR2235STRPBF is 100-200 ns, but it can be adjusted based on the specific application requirements.
  • Yes, the IR2235STRPBF can be used in a half-bridge configuration, but it requires an external bootstrap diode and a suitable gate drive circuit.
  • The IR2235STRPBF has built-in overvoltage and undervoltage protection, but additional external protection circuits may be required depending on the specific application requirements.

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IR2235STRPBF Overview

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