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IR25606SPBF - Infineon

Description: Gate Drivers 2Ch 600V Half Bridge 200mA 350mA 10-20V

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IR25606SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IR25606SPBF - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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IR25606SPBF Details

  • Manufacturer Part Number:

    IR25606SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.3 µs

  • Width:

    3.9 mm

IR25606SPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IR25606SPBF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management.
  • A recommended PCB layout for minimizing EMI includes using a solid ground plane, keeping high-frequency traces short and away from sensitive nodes, and using shielding and filtering components as needed.
  • No, the IR25606SPBF is rated for a maximum voltage of 600V. Using it in an application above 600V may result in device failure or reduced lifespan.
  • To troubleshoot issues, start by checking the device's operating conditions, including voltage, current, and temperature. Verify that the device is properly soldered and that the PCB layout meets the recommended guidelines.

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IR25606SPBF Overview

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