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IR3475MTRPBF - Infineon

Description: Switching Voltage Regulators 10A SupIRBuck Reg 750kHz, 3.0-27V in

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IR3475MTRPBF - Infineon PCB footprint - Other - Other - IR3475MTRPBF-4
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IR3475MTRPBF - Infineon  - 3D model - Other - IR3475MTRPBF-4
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IR3475MTRPBF Details

  • Manufacturer Part Number:

    IR3475MTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    4 X 5 MM, LEAD FREE, QFN-17

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE FROM 0.5 TO 12V; PWM CONTROL TECHNIQUE ALSO POSSIBLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    HYSTERETIC CURRENT MODE

  • Input Voltage-Max:

    27 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XQCC-N17

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    17

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Output Voltage-Max:

    12 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC17(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    750 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.55 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

IR3475MTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Critical components include the input capacitors, output inductors, and output capacitors. Ensure that these components are selected based on the recommended specifications and operating conditions.
  • Check the input voltage, output voltage, and current levels. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to monitor the voltage and current waveforms. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the IR3475MTRPBF is designed for high-reliability applications. However, it is essential to follow the recommended design guidelines, testing, and validation procedures to ensure the device meets the required safety and reliability standards.

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