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IR44272LTRPBF - Infineon

Description: INFINEON - IR44272LTRPBF - MOSFET/IGBT DRIVER, NON-INVERTING, SOT23

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PCB Footprints
IR44272LTRPBF - Infineon PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT23-5-1
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IR44272LTRPBF - Infineon  - 3D model - SOT23 (5-Pin) - SOT23-5-1
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IR44272LTRPBF Details

  • Manufacturer Part Number:

    IR44272LTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 5 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    1.7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.05 µs

  • Width:

    1.625 mm

IR44272LTRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IR44272LTRPBF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management, and ensuring that the device is operated within its specified temperature range.
  • To minimize EMI, it's recommended to follow a compact PCB layout with short traces, use a solid ground plane, and place decoupling capacitors close to the device. Additionally, using a shielded layout and minimizing loop areas can help reduce EMI.
  • When selecting input and output capacitors, consider the device's operating frequency, output current, and voltage ripple requirements. Choose capacitors with low equivalent series resistance (ESR) and a high ripple current rating to ensure stable operation.
  • When designing a stable feedback loop, consider the device's gain and phase margins, and ensure that the loop gain is less than 0 dB at the crossover frequency. Additionally, use a compensation network to stabilize the loop and ensure that the device operates within its specified bandwidth.

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